Meeting the needs of customers engaged in device
manufacturing, microelectronics packaging, printed circuit board
assembly and other emerging integrated circuit packaging technologies.
Developing
gas and chemical technologies.
Providing
process technical support.
Evaluating
and developing new applications.
Providing
technology focus and assessment.
Offering
global applications support.
Supporting
diverse technologies: printed circuit board soldering, hybrid circuits,
advanced packaging and assembly, PCB manufacturing and fibreoptics
and flat panel displays.
Developing
gas and chemical technologies.
